Tamper indicating radio frequency identification label

ABSTRACT

A tamper indicating label is provided. The label may include RFID components and a tamper track coupled to the RFID components. The tamper track should be constructed from a destructible conducting path. Additionally, the tamper track can be formed such that it is damaged when the label is tampered. In one embodiment, adhesion characteristics of the tamper track are adapted to break apart the tamper track when the label is tampered, for example, by removal from an object. The RFID components may retain their RF capability and detect when the tamper track has been damaged to indicate that the label has been tampered. Alternatively, the RFID capability of the RFID components may be disabled when the tamper track is damaged, indicating tampering.

BACKGROUND OF THE INVENTION

[0001] Radio Frequency Identification (RFID) is being used increasinglyas a means to identify goods at a distance, without requiring physicalcontact or even line of sight access to the goods. RFID enablesinformation about an item to be stored on an item, and in someimplementations also allows this stored information to be modified at adistance. The most compact and cost effective means to provide this RFIDcapability is by means of a pressure sensitive (i.e. self adhesive)label incorporating an RFID capability.

[0002] The ability to detect remotely whether a pressure sensitive labelor seal applied to an item has been tampered with or removed is becomingincreasingly important in order to detect theft, product substitution,tampering, warranty violation and other problems.

[0003] A disadvantage of current pressure sensitive label technology isthat it does not allow the remote determination of whether or not alabel has been tampered with or removed and relocated.

DISCLOSURE OF THE INVENTION

[0004] A tamper indicating label is provided. The label may compriseRFID components and a tamper track connected to the RFID components. Thetamper track is preferably formed by destructible electronics. Thetamper track may be modified when the label is tampered with. In oneembodiment, the RFID components are able to detect the modification inthe tamper track while maintaining their RFID capability. Detection ofthe modification in the tamper track indicates tampering with the label.In an alternative embodiment, the modification in the tamper trackdisables the RFID function.

[0005] In a further embodiment, the label comprises an RFID layer. TheRFID layer may include a memory chip and at least one of an antenna orloop inductor. Means for attaching the RFID layer to an object may alsobe provided. The means for attaching may be an adhesive layer. Theadhesive layer can support the RFID layer. A destructible conductingpath may be sandwiched between the RFID layer and the adhesive layer.The destructible conducting path should be disrupted when the label istampered. The disruption preferably modifies in some way the RFIDcharacteristics of the RFID layer.

[0006] In a further embodiment, at least a part of the destructibleconducting path may in contact with the adhesive layer. The destructibleconducting path can thereby be modified when the label is at leastpartially removed from a surface, and in turn, modify RFIDcharacteristics of the label, indicating tampering.

[0007] According to another embodiment, the invention includes an RFIDsystem. A substrate having a top and a bottom surface is provided. RFIDelectronic components are applied to the bottom surface of thesubstrate. A conductive layer may also be formed in a pattern on thebottom surface of the substrate. An adhesive layer may support thesubstrate such that the RFID electronic components and the conductivelayer are sandwiched between the substrate and the adhesive layer. Theadhesive layer, the substrate, and conductive layer should have relativeadhesion strengths such that when the system is partially removed from asurface to which it has been applied, at least one of the RFIDcomponents and the conductive layer is altered to modify the RFIDcharacteristics of the system.

[0008] According to another embodiment of the invention, a securityapparatus for indicating tampering is provided. Here, an object may beprovided with a conducting path having at least two end points. Asecurity label is arranged on the object. The security label may be atamper indicating label as described above and should include RFIDcomponents and a destructible conducting path between the RF componentsand each individual end point.

[0009] In one of the more detailed embodiments of the invention, asecurity label is combined with an object. The security label maycomprise RFID components and means for attaching the RFID components tothe object. Destructible electronics may be connected to the RFIDcomponents. The destructible electronics can be broken when the label isat least partially removed from the object. The object comprises asurface for receiving the security label and a conducting path havingtwo ends. The ends of the conducting path may be connected to thedestructible electronics thereby forming a circuit through the RFIDcomponents, the destructible electronics and the conducting path. TheRFID characteristics of the RFID components may be modified if theconnection between the end points and the destructible electronics isbroken.

[0010] According to another embodiment of the invention, a substratehaving first and second portions is provided. The second portion of thesubstrate may be adapted to be looped back and connected to the firstportion. An RFID transponder can be arranged on the substrate. A tampertrack may be coupled to the RFID transponder and should extend at leastpartially into the second portion of the substrate. An adhesive layershould be provided on at least a part of the second portion of thesubstrate that includes the tamper track. The tamper track in that partof the substrate may be adapted to be modified when the label istampered with due to the relative adhesion strength of the tamper track.

BRIEF DESCRIPTION OF THE FIGURES

[0011] The present invention will now be described by way ofnon-limiting example with reference to the accompanying drawings,wherein:

[0012]FIG. 1 is a schematic illustration of the general design of atamper indicating RFID label which is the subject of the presentinvention;

[0013]FIGS. 2a and 2 b are a schematic illustration of a preferredembodiment and characteristics of the tamper indicating layer within atamper indicating RFID label;

[0014]FIG. 3 is a schematic illustration of a preferred embodiment ofthe tamper indicating conducting strip in the tamper indicating layer ofa tamper indicating RFID label;

[0015]FIG. 4 is a schematic illustration of a preferred embodiment of atamper indicating RFID label in which the tamper indicating conductingstrip is in series with an induction loop in said label;

[0016]FIG. 5 is a schematic illustration of a preferred embodiment of atamper indicating RFID label in which the tamper indicating conductingstrip forms the induction loop of said label;

[0017]FIG. 6 is a schematic illustration of a preferred embodiment of atamper indicating RFID label in which the tamper indicating conductingstrips form the antenna of said label;

[0018]FIG. 7 is a schematic illustration of an variation of RFID labelof FIG. 6;

[0019]FIG. 8 is a schematic illustration of a method of manufacturing anRFID label according to an embodiment of the invention;

[0020]FIG. 9 is a schematic illustration of another embodiment of theinvention;

[0021]FIG. 10 is a schematic illustration of the top view, side view andbottom view of a preferred embodiment of a tamper indicating RFID labelwhich is the subject of the present invention;

[0022]FIG. 10a is a schematic illustration of the detail of a portion ofthe tamper indicating RFID label of FIG. 1;

[0023]FIG. 11 is a schematic illustration of a variation of the RFIDlabel of FIG. 10;

[0024]FIG. 12 is a schematic illustration of loop tag based on thetamper indicating label design of FIGS. 1 and 2;

[0025]FIG. 13 is a schematic illustration of the use of a loop tag ofthe type illustrated in FIG. 3;

[0026]FIG. 14 is a schematic illustration of an object having a RFIDlabel applied.

DETAIL DESCRIPTION OF THE INVENTION

[0027] The term “passive”, as used herein, refers to an RFID label ortransponder which does not include an on-board power source such as abattery. The term “active”, as used herein, refers to an RFID label ortransponder which includes an on-board power source such as a battery.The advantages of an active RFID label, relative to a passive RFIDlabel, is that an active RFID label can include continuous on-boardfunctions such as a clock, and can usually enable longer read and writedistances. A disadvantage of active RFID labels, relative to passiveRFID labels, is that active RFID labels are physically larger due to theneed to carry an on-board power source.

[0028] It should be appreciated that the terms label and tag may be usedinterchangeably in this document. Where the term label is used, the termtag may validly be substituted. The essential difference between the twois the thickness and types of material used in the construction. Ingeneral a label will be made from thin, flexible materials, while a tagwill be made from thicker, stiffer materials. A tag may, for example, besimilar to a plastic card with a pressure sensitive adhesive on theunderside. Such tags may be used, for example, as compliance plates orrating plates or specification plates on various types of equipment. Atag, because of its greater thickness, is better suited to active RFIDtechnology.

[0029] It should be appreciated that the illustrations herein are not toscale. In general the thickness of the label constructions (andcomponent layers thereof) illustrated in the figures have beenexaggerated, to illustrate more clearly the internal structures andcomponents.

[0030] In general, a tamper indicating label is provided. The label mayinclude RFID components and a tamper track coupled to the RFIDcomponents. The tamper track should be constructed from a destructibleconducting path. Additionally, the tamper track can be formed such thatit is damaged when the label is tampered. In one embodiment, adhesioncharacteristics of the tamper track are adapted to break apart thetamper track when the label is tampered, for example, by removal from anobject. The RFID components may retain their RFID capability and detectwhen the tamper track has been damaged to indicate that the label hasbeen tampered. Alternatively, the RFID capability of the RFID componentsmay be disabled when the tamper track is damaged, indicating tampering.

[0031]FIG. 1 is a schematic illustration of the general design of atamper indicating RFID label according to an embodiment of theinvention. FIG. 1 shows schematically a pressure sensitive (i.e.self-adhesive) label 100 in cross sectional view. The label 100 mayinclude four functionally distinct layers.

[0032] The RFID layer 101 may be a layer which includes RFID components,for example, an RFID memory chip. The label 100 may in some embodimentsprovide an “active” RFID capability, in which case the layer 101 canalso include a battery or other power source.

[0033] The second layer 102 may include one or more thin electricallyconducting tracks which should be coupled to the RFID components in thelayer 101. The tracks are known herein as “tamper tracks” since theyprovide a means to detect tampering with or removal of the label 100from a surface to which it has been applied.

[0034] The layer 101 and the layer 102 may together provide an RFIDcapability. On the other hand, in some embodiments the layer 101 canprovide an RFID capability in its own right, while the tamper tracks 102can modify the RFID performance of the layer 101 depending on whethersaid tamper tracks 102 are damaged or not.

[0035] The RFID capability provided by the layer 101, or the layers 101and 102 together, usually includes the ability to store information inthe RFID memory chip in the layer 101, and the ability to read andmodify said stored information from a distance. Additional capabilities,such as the ability to encrypt stored information or control access tothe stored information, may also be provided.

[0036] The third layer 103 may be an adhesive layer, which in someembodiments is a pressure sensitive adhesive.

[0037] The fourth layer 104 is a top-coat layer applied over the top ofthe RFID layer 101. The top-coat may be applied to protect the RFIDlayer and to provide a top surface to accept a printing process. The topcoat layer 104 is not essential and in some embodiments may not beincluded. The finished construction is the adhesive label 100.

[0038] The tamper tracks 102 should be destructible. When the label 100is applied to a surface and subsequently tampered or removed, thepressure sensitive adhesive 103 damages the tamper tracks 102—forexample, by tearing all or part of them from the underside of the layer101—which in turn affects the RFID performance of the label 100. Sincethe tamper tracks 102 are electrically connected to the RFID componentsin the label 100, and may form part of the RFID components of the label100, the RFID function of the label 100 is modified if the label isapplied to a surface and subsequently tampered or removed. In this waytampering with or removal of the label 100 can be detected at a distancevia the change in the RFID characteristics and response of the label100.

[0039] The terms “tampering” and “tampered” as used herein refer tocomplete or partial removal of a tamper indicating label, such as thelabel 100, from a surface to which it has been applied.

[0040] In this document the term “destructible” is used in relation tothe tamper tracks 102 in FIG. 1 and in relation to other tamper tracksthroughout the document. In this context the term destructible meansthat the tamper tracks are designed to be damaged or broken in regionsof the label which are tampered.

[0041] The tamper tracks 102 may be produced in one of a number ofdifferent ways. In one preferred embodiment, the tamper tracks may beproduced by printing electrically conducting ink (such as acarbon/graphite based conductive ink or a precious metal ink). Inanother preferred embodiment the tamper tracks 102 may be produced usingelectrically conductive adhesive. In another embodiment the tampertracks may be metallic tracks made of Aluminum, Copper or some othersuitable metal.

[0042] In general the tamper tracks 102 should be made from a material,such as an electrically conducting ink, which has appropriate electricalproperties but which does not have high intrinsic physical strength. Inthis way the tamper tracks 102 can be more easily disrupted or damagedas the label 100 is partially or completely removed from a surface towhich it has been applied.

[0043] In some preferred embodiments the destructibility of the tampertracks 102 may be enhanced by including a thin layer of a suitableadhesion modifying coating on the underside of the layer 101 eitherbetween the layer 101 and the tamper tracks 102, or between the tampertracks 102 and the adhesive 103. At least a part of the tamper tracksshould contact the adhesive 103. The layer of adhesion modifying coatingmay be applied as a uniform layer, or in a specified pattern, or in someother manner such that the properties of the adhesion modifying coatingvary across the layer 101. In some embodiments multiple layers ofadhesion modifying coating may be applied to “fine tune” the propertiesof the final composite adhesion modifying coating.

[0044] Inclusion of a adhesion modifying coating between the RFID layer101 and the tamper tracks 102 results in the adhesion of the layers toeach other being greater or less in a particular region according towhether the adhesion modifying coating is present or absent in thatregion. Similarly, inclusion of an adhesion modifying coating betweenthe tamper tracks 102 and the adhesive layer 103 results in the adhesionof the layers to each other being greater or less in a particular regionaccording to whether the adhesion modifying coating is absent or presentin that region. Usually, but not necessarily, the adhesion modifyingcoating reduces the adhesion of two layers which it separates, so thatthe two layers can be more easily separated.

[0045] The relative adhesion between the layer 101, adhesion modifyingcoating, tamper tracks 102 and adhesive layer 103 can be adjusted sothat when the label 100 is applied to a surface and subsequentlytampered or removed, the tamper tracks 102 are damaged in a patterncorresponding to the pattern of the adhesion modifying coating. In someembodiments the tamper tracks 102 may be physically separated in apattern corresponding to the pattern of the adhesion modifying coating,with some of the tamper tracks 102 remaining on the layer 101 and theremainder of the tamper tracks 102 remaining on the adhesive layer 103.This damage to the tamper tracks 102 may affect the RFID performance ofthe label 100.

[0046] The adhesion modifying coating may be a layer of lacquer, or alayer of tamper indicating varnish (for example, similar to that used insome visual tamper indicating label constructions), or a layer of someother suitable material formulation.

[0047] The tampering indicating characteristics of one preferredembodiment of the label 100 are illustrated in FIG. 2, which shows thelabel 100 in cross section view before and after removal from a surface201. FIG. 2 illustrates in particular the physical disruption of thetamper tracks 102 during tampering or removal of the label 100. In FIG.2(a) the label 100 is shown before removal from the surface 201. Herethe tamper tracks 102 are intact and the label 100 exhibits its normalRFID operation. In FIG. 2(b) the label 100 has been partially removedfrom the surface 201. As the label 100 is removed, portions of thetamper tracks 102 remain with the top layer 101, and complementaryportions of the tamper tracks 102 remain with the adhesive layer 103.The differential separation of the tamper tracks 102 may in someembodiments be enhanced or achieved through the inclusion of an adhesionmodifying coating (as described above) in a specified pattern at theinterface between the layer 101 and the tamper tracks 102, such that thetamper tracks 102 bond less strongly to the layer 101 where the adhesionmodifying coating has been applied and therefore in such regions thetamper tracks 102 remain with the adhesive layer 103 when the label 100is removed from the surface 201. As the label 100 is removed from thesurface 201, the tamper tracks 102 are damaged, and their electricalproperties are thereby affected. This in turn affects the RFIDproperties of the label 100, since the tamper tracks 102 areelectrically connected to the layer 101 which includes RFID components.In FIG. 2 the separation of (i.e. damage to) the tamper tracks 102during tampering of the label 100 is shown to form a regular repeatingpattern. It should be appreciated that the pattern of the separation mayinstead be irregular and may be on a larger or smaller scale relative tothe size of the label 100 or the RFID components in the label 100 thanshown in FIG. 2.

[0048] The label 100 may also contain information in another format,such as a barcode, 2D barcode, or some other optical information storageformat printed on the top surface of the top coat layer 104.

[0049] A preferred embodiment of the tamper tracks 102 will now bedescribed with reference to FIG. 3, which shows an embodiment of theRFID label 100 in cross sectional view and looking from below throughthe adhesive layer 103 at the tamper tracks 102. In FIG. 3 the RFIDlayer 101 has two “through-connect” electrical connection points, 301and 302, where the electrical circuitry in the RFID layer 101 isconnected to the underside of the layer 101. In this embodiment theelectrical connection between the points 301 and 302 by means of thetamper track 102 should be intact in order to maintain normal RFIDoperation of the label 100.

[0050] Preferably the tamper track 102 may be disrupted even if only aportion of the label 100 is tampered. In FIG. 3 the tamper track 102runs around the perimeter of the underside of the layer 101 betweenpoints 301 and 302. This configuration for the tamper track 102 of FIG.3 ensures that tampering of even a small portion of the label 100 willresult in a break in the tamper track 102 and therefore a break in theelectrical connection between the points 301 and 302, which in turnmodifies the RFID behavior of the label 100.

[0051] It should be appreciated that other configurations of the tampertrack 102 could also be employed. For example, in some embodiments thetamper track 102 may form all or part of an antenna, in which case thepoints 301 and 302 may not be electrically connected to each other via asingle tamper track 102.

[0052] An RFID label will generally include an electronic memory chipconnected to either an induction loop or an antenna. The induction loopor antenna may enable communication and data exchange with a remotereading device. (It should be appreciated that different types ofantenna design may be employed.) Other electrical or electroniccomponents may also be included in an RFID label. An active RFID labelwill include an on-board power source such as a battery.

[0053] Preferred embodiments of ways in which the tamper tracks 102 canbe configured on the underside of the RFID layer 101 and coupled to theRFID layer 101 will be now be described by way of non-limiting example.It should be appreciated that in some embodiments the tamper tracks 102may be designed to be destructible in some regions and durable in otherregions. For example, the tamper tracks 102 may include some sectionswhich are durable and rugged, joined by sections which are destructible.

[0054] The tamper tracks 102 may be connected in one of severaldifferent ways to the RFID layer 101, depending on the design andoperation of the RFID layer 101. Several non-limiting examples arelisted below.

[0055] 1. The tamper tracks 102 may be connected in series with aninduction loop or antenna in the layer 101.

[0056] 2. The tamper tracks 102 may constitute all or part of theinduction loop or antenna of the label 100.

[0057] 3. The tamper tracks 102 may be part of a tamper-sensingelectrical circuit in the label 100 which is separate from the inductionloop or antenna of the label 100.

[0058] FIGS. 4 to 7 are schematic illustrations of further preferredembodiments of the tamper indicating RFID label 100, showing both across sectional view and a view looking from below through the adhesivelayer 103 at the tamper tracks 102.

[0059]FIG. 4 is a schematic illustration of a preferred embodiment inwhich the tamper track 102 connects the points 301 and 302 and is inseries with an induction loop 401 in the RFID layer 101. The RFID layer101 may include the induction loop 401 and other components 402, whichmay be passive or active. For example, the components 402 in oneembodiment may be a capacitor which, with the induction loop 401, formsa resonant electrical circuit. Alternatively, the components 402 mayinclude a passive electronic memory chip for storing data. The tampertrack 102 should be intact for the RFID label 100 of FIG. 4 to beoperational. When the label 100 is tampered, the tamper track 102 isbroken and the RFID function of the label 100 can be disabled ormodified. In this way it can be determined whether or not the label 100has been tampered. An adhesion modifying coating may be included, asdescribed above, to enhance destructibility of the tamper tracks 102.

[0060]FIG. 5 is a schematic illustration of another preferred embodimentin which the tamper track 102 forms an induction loop 501 for the RFIDlabel 100. In FIG. 5 the through-connect points 301 and 302 areconnected to the RFID components 402 in the layer 101. In connecting thepoints 301 and 302, the tamper track 102 forms a number of loops, withthe overall layout of the tamper track 102 acting as an induction loop.Tampering or removing the label 100 results in a break in the tampertrack 102, thereby disabling or modifying the RFID function of the label100. In this way it can be determined whether or not the label 100 hasbeen tampered. An adhesion modifying coating may be included, asdescribed above, to enhance destructibility of the tamper tracks 102.

[0061]FIG. 6 is a schematic illustration of another preferredembodiment, which is a variation on the embodiment of FIG. 5. In FIG. 6the tamper tracks 102 form an antenna, whereas in FIG. 5 the tampertrack 102 forms an induction loop. The principal difference is that inFIG. 6 the points 301 and 302 are not connected together by a singletamper track 102. Instead there are two tamper tracks 102, one startingat point 301 and the other starting at the point 302. The two tampertracks 102 form an antenna. In FIG. 6 a so-called meander antenna isillustrated, although it should be appreciated that other forms ofantenna may also be employed. In some antenna designs the points 301 and302 may be connected to each other by the tamper track 102. In FIG. 6the through-connect points 301 and 302 are connected to the RFIDcomponents 402. Tampering the label 100 should result in damage to atleast one of the tamper tracks 102, thereby affecting thecharacteristics of the antenna and modifying or disabling the RFIDfunction of the label 100. In this way it can be determined whether ornot the label 100 has been tampered. An adhesion modifying coating maybe included, as described above, to enhance destructibility of thetamper tracks 102.

[0062]FIG. 7 is a schematic illustration of another preferredembodiment, based on the embodiments of FIGS. 5 and 6. The principaldifference between the designs illustrated in FIGS. 5 and 6, and thedesign illustrated in FIG. 7 is that in the design of FIG. 7 the RFIDcomponents 402 are on the underside of the layer 101. In someembodiments the RFID components 402 may comprise only an RFID memorychip, in which case in the design of FIG. 7, both the RFID memory chip402 and the tamper tracks 102 are on the underside of the layer 101. Thetamper tracks are designed to be destructible, as described herein. Anadvantage of the design of FIG. 7 compared with the designs of FIGS. 5and 6 is that in the design of FIG. 7 there is no need forthrough-connects to the bottom side of the layer 101, since the RFIDmemory chip is on the bottom side of the layer 101. In the design ofFIG. 7 the tamper tracks 102 may form an induction loop, as in thedesign of FIG. 5, or may form an antenna, as in the design of FIG. 6. InFIG. 7 an antenna is shown. An adhesion modifying coating may beincluded, as described above, to enhance destructibility of the tampertracks 102.

[0063] In order to provide an additional indicator of tampering, thelabel 100 may be designed to show visual evidence of tampering if thelabel is removed from a surface to which it has been applied. Visualtamper indication can be achieved in several ways. In one embodiment athin colored layer is applied to the underside of the RFID layer 101. Apattern of adhesion-modifying layer may be applied to the underside ofthe colored layer. The adhesion-modifying layer may be the same layer ora layer in addition to the adhesion modifying coating described above.The presence of the adhesion-modifying layer modifies the adhesion ofthe colored layer to the adhesive layer 103 such that when the label 100is removed from a surface to which it has been applied, the coloredlayer breaks up. Areas of color may adhere to the adhesive layer 103 andother complementary areas of color may adhere to the RFID layer 101. Analternative to this embodiment is to apply a pattern of said adhesionmodifying layer directly to the underside of the RFID layer 101 andapply said thin colored layer to the underside of said adhesionmodifying layer. In another embodiment, the adhesion modifying coatingmay be applied directly to the underside of the RFID layer 101 and acolored adhesive can be used as the adhesive layer 103. In this case,when the label is removed from a surface to which it has been applied,the colored adhesive 103 should break up and areas of the coloredadhesive may adhere to the RFID layer 101 and complementary areas of thecolored adhesive 103 may adhere to the surface. It should be appreciatedthat other methods may be used to produce a visual tamper indicatingeffect.

[0064] When using a visual tamper indicating effect, a portion of theRFID layer 101 and top coat 104 (if a top coat 104 is present) should betransparent so the visual effect can be seen by looking through the RFIDlayer 101 and top coat 104. This enables easy inspection of the visualtamper indicating feature without having to remove the label. The RFIDcomponents in the RFID layer 101, such as a memory chip, may not betransparent, but should only occupy a small portion of the surface area.

[0065] Additionally, it may be desired to print information or patternson the label. For example, as described above, a bar code or serialnumber may be printed on the top surface of the RFID layer 101 or on thetop surface of the top coat 104 (if a top coat 104 is present). Enoughof the RFID layer 101 and top coat 104 should be transparent to allowthe visual tamper indicating feature to be visible.

[0066] Method of Manufacture

[0067] A preferred method of manufacture for the label configurationdescribed above in relation to FIG. 7 is now described and illustratedschematically in FIG. 8, which shows illustrations of an RFID labelconstruction and method of manufacture in cross sectional view.

[0068] The diagram of FIG. 8 illustrates a passive RFID labelconstruction, in which the RFID components 402 consists of an RFIDelectronic memory chip.

[0069] A pattern 801 of adhesion modifying coating may be applied to theunderside of a substrate layer 802, which may in one embodiment be apolyester layer. The tamper tracks 803 can be printed on the undersideof the adhesion modifying coating. If necessary the tamper tracks caninclude a “cross-over”, where a tamper track 803 crosses over itselfalong a bridging layer of electrical insulator. The tamper tracks 803may be configured to form either an induction loop or antenna ofappropriate design and characteristics. An RFID electronic memory chip804 can then be mounted on the underside of the layer 802 and positionedto connect to appropriate terminating points on the tamper tracks 803.The RFID chip 804 and tamper tracks 803 should form an RFID transponder.The construction 805 consisting of substrate 802, adhesion modifyingcoating 801, tamper tracks 803 and RFID chip 804 is cut into individualtransponders 806. Each transponder 806 is placed in a specified positionon the underside of a top coat layer 807 and may be fixed in positionwith a thin adhesive layer. A layer of pressure sensitive adhesive 808may be applied to the underside of the top coat 807 and individualtransponders 806. The resulting construction consisting of top coatlayer 807, individual transponders 806 and adhesive layer 808 is mountedon a suitable carrier film 809 and produced in roll form. The resultingroll is die cut into individual labels 810 mounted on the continuouscarrier film 809, where each label 810 includes one transponder 806.

[0070] In a variation on the method of manufacture illustrated in FIG.8, the tamper tracks 803 may be produced using an electricallyconducting adhesive instead of an electrically conducting ink.

[0071] Tamper Indicating RFID Label with Tracking Capability

[0072]FIG. 9 is a schematic illustration of another preferred embodimentin which the tamper track 102 forms part of a separate tamper indicatingelectrical circuit. As shown in FIG. 9 the RFID layer 101 may contain aninduction loop or antenna 901 and other electronic components 402,including an electronic memory chip, to provide an RFID capability. TheRFID layer 101 should be capable of interacting with an RFID readingdevice to allow reading of or modification to data stored in theelectronic memory chip. The through-connect points 301 and 302 areconnected to the components 402 in the layer 101, and to each other viathe tamper track 102. The components 402 should be configured to responddifferently to a signal from an RFID reader depending on whether or notthe points 301 and 302 are connected to each other via the tamper track102 or not. If the tamper track 102 is intact, the label 100 willrespond in a specified manner to an RFID reader. On the other hand, ifthe label 100 is tampered, so that the tamper track 102 is damaged andthe points 301 and 302 are no longer connected to each other via thetamper track 102, the label 100 should still respond to an RFID readerbut in a different manner, thereby indicating that the label 100 hasbeen tampered. In this way the label 100 of FIG. 9 can provide an RFIDmeans to (i) determine whether the label 100 is present, (ii) read datafrom the label 100 and modify data stored in the label 100, and (iii)determine whether the label 100 has been tampered. In one preferredembodiment the components 402 may consist only of a passive RFIDelectronic memory chip, and the tamper track 102 forms a connection,which may be separate from the induction loop or antenna 901, betweentwo contact points on the memory chip.

[0073] In a variation on the embodiments described above, the components402 may undergo an irreversible change if the label 100 is tampered andthe tamper track 102 is damaged, so that even if the tamper track 102 issubsequently restored, the label 100 will still respond to an RFIDreader with a signal indicating it has been tampered. In one preferredembodiment the RFID components 402 is “active” (i.e. powered) and isconfigured to test the integrity of the tamper track 102 eithercontinuously or at specified intervals. In this embodiment if the RFIDcomponents 402 detect that the tamper track 102 has been disrupted theymay then preferably be configured to record data to this effect in theelectronic memory chip within the components 402, preferably in a mannerwhich is permanent and irreversible. Preferably, if the components 402are active, they may also include a clock. In this case, the date andtime of any tampering of the tamper track 102 or label 100 may alsopreferably be recorded permanently and irreversibly in the electronicmemory chip within the RFID components 402.

[0074] A preferred embodiment of the tamper indicating RFID labelconfiguration of FIG. 9 will now be described by way of non-limitingexample with reference to the schematic illustrations shown in FIGS. 10and 11.

[0075] It should be appreciated that the term antenna as used below mayrefer to a conventional antenna or to an induction loop (which is usedas an antenna at some RFID operating frequencies).

[0076]FIG. 10 is a schematic illustration of a tamper indicating RFIDlabel 1000 shown in top view, cross sectional side view, and bottomview.

[0077] The label 1000 may include a substrate layer 1001 made of, forexample, polyester or some other suitable material. On top of thesubstrate layer 1001,electronics to form an RFID transponder, whichprovides an RFID function, may be applied. The electronics may includean RFID electronic memory chip 1002 and an antenna 1003. (In FIG. 10 anantenna 1003 in the form of an induction loop is shown.)

[0078]FIG. 11 is a more detailed schematic illustration of an example ofthe electrical connections to the electronic chip 1002.

[0079] The chip 1002 and antenna 1003 should provide an RFID capability,which may include the ability to store information in the chip 1002, theability to read information from the chip 1002 at a distance using asuitable RFID device, and the ability to modify information in the chip1002 from a distance using a suitable RFID device.

[0080] The chip 1002 may include two contact points, or contact pads,connected to the antenna 1003, as illustrated in FIG. 10(a).

[0081] The two contact pads on the chip 1002 can be connected viaelectrical “through-connects” 1004 to the underside of the substratelayer 1001. One or both or neither of these two contact pads may be thesame as the contact pads used to connect the chip 1002 to the antenna1003. FIG. 10(a) shows the through-connects 1004 directly beneath thechip 1002. It should be appreciated that other configurations mayinstead be used for the through-connects 1004. In another preferredembodiment, the through-connects 1004 are positioned away from thecontact pads on the chip 1002, and electrical tracks on the top surfaceof the substrate layer 1001 connect the contact pads on the chip 1002 tothe tops of the through-connects 1004.

[0082] The two through-connect points 1004 on the underside of thesubstrate layer 1001 are connected to each other by means of a tampertrack 1005 which is positioned on the underside of the substrate layer1001.

[0083] A layer of adhesive 1006 may also be applied to the underside ofthe substrate layer 1001 and tamper track 1005. Preferably said adhesive1006 is a pressure sensitive adhesive.

[0084] A top layer 1007 may be applied over the top of the substrate1001, chip 1002 and antenna 1003. The top layer 1007 can provideprotection for these components and can also provide a surface to acceptprinting—for example printing of a number, a barcode, a logo, or otherimage.

[0085] It should be appreciated that in FIG. 10 the top view is a viewlooking through the top layer 1007, the side view is a cross sectionalside view, and the bottom view is a view looking though the adhesivelayer 1006.

[0086] The tamper track 1005 is preferably applied to the underside ofthe substrate layer 1001, along with one or more layers of adhesionmodifying coating to enhance the destructibility of the tamper track1005. Consequently, if the label 1000 is applied to a surface andsubsequently removed, the tamper track 1005 should be broken ordisrupted so as to interrupt the electrical connection between thethrough-connect points 1004 on the underside of the substrate layer1001. Application of the tamper track 1005 and any other adhesionmodifying coatings to the underside of the substrate 1001 to enhance thedestructible nature of the tamper track 1005 may preferably be carriedout as described in the following provisional patent applications, whichare incorporated by reference:

[0087] 1. “A Tamper Indicating Radio Frequency Identification Label andMethods for the Manufacture Thereof”; Filed Jul. 28, 2000; U.S.Provisional Patent Application No.: 60/221,640

[0088] 2. “A Tamper Indicating Radio Frequency Identification Label andMethods for the Manufacture Thereof”; Filed Sep. 28, 2000; U.S.Provisional Patent Application No.: to be advised

[0089] The tamper track 1005 may be laid out in a number of differentways on the underside of the substrate layer 1001. In the preferredembodiment illustrated in FIG. 10, the tamper track runs from onethrough-connect point 1004 almost all the way around the perimeter ofthe underside of the substrate layer 1001 and then back to the otherthrough-connect point, with the outward and return paths of the tampertrack 1005 very close together in order to avoid any electricalinduction effects which may interfere with the antenna 1003 positionedabove on the upper surface of the substrate layer 1001. The width andthickness of the tamper track 1005 can be adjusted to provide thecorrect properties in terms of electrical resistance and physicaldestructibility. The path made by the tamper track 1005 may run inside,or outside, or directly beneath the antenna 1003, which in FIG. 10 is aninduction loop. In one preferred embodiment the tamper track 1005 formsa path which is outside the outer perimeter of the induction loop 1003,thereby ensuring that any disturbance around the perimeter of the label1000 will cause the tamper track 1005 to be disrupted.

[0090] When the label 1000 is applied to a surface, the tamper track1005 is intact and the corresponding contact pads on the chip 1002 areelectrically connected to each other. When the label 1000 is removed orsubstantially tampered with, the tamper track 1005 should be broken ordisrupted and there will then be an open circuit between thecorresponding contact pads on the chip 1002. When such an open circuitoccurs, the function of the RFID chip 1002 or the information stored inthe chip 1002 will be modified in a way which can be detected by an RFIDreader.

[0091] If the label 1000 is passive (i.e. without an on-board battery orother power source), the modified chip function or information can bedetected during the first read operation of the label after the label1000 is removed or tampered, and the reader (if it has a writecapability) can be programmed to write data back to the chip 1002 toindicate that the label 1000 has been removed or tampered. Said datawhich is written back to the chip 1002 to indicate removal or tamperingof the label 1000 is preferably permanent and irreversible, to preventthe memory contents of the chip being altered back to the original stateto disguise the fact that the label has been moved or tampered. There istherefore disclosed herein an RFID read/write device capable ofdetecting the change in RFID performance of the label 1000 when thelabel 1000 is tampered, and writing data back to the chip 1002 withinthe label 1000 to indicate such tampering has occurred, said datapreferably being written into the chip 1002 so as to be permanent andirreversible.

[0092] If the label 1000 is active (i.e. has an on-board battery orother power source), it can be configured such that any disruption tothe tamper track 1005 can be detected internally within the label 1000without requiring an RFID read operation. When such disruption to thetamper track 1005 is detected internally, the chip 1002 can beprogrammed to modify its own memory contents to indicate that the label1000 has been removed or tampered. Said modification to the memorycontents of the chip 1002 to indicate removal or tampering of the label1000 should preferably be permanent and irreversible, to prevent thememory contents of the chip being altered back to the original state todisguise the fact that the label has been moved or tampered.

[0093] Hence the label 1000 may function as a normal RFID label when itis first applied to a surface. After is the label is moved or tampered,the RFID function of the label 1000 may be maintained and informationcan be read from and written to the RFID chip 1002, while the label alsoprovides an RFID means to determine that it has been moved or tampered.

[0094]FIG. 11 is a variation on the preferred embodiment of FIGS. 9 and10. The basic design of the label 1000 in FIG. 11 is the similar to thatof FIG. 10. The difference in the design of FIG. 11 is that the tampertrack 1005 extends well beyond the antenna 1003 or other RFID componentsin at least one direction. The tamper track 1005 should run around theperimeter of the label 1000 and detect tampering of any edge portion ofthe label, whether near the chip 1002 and antenna 1003 or at the end ofthe label away from these components. The label 1000 can, for example,be applied around a corner so that the chip 1002 and antenna 1003 are ona flat surface while the other end of the transponder, which includesthe tamper track 1005, extends around the corner.

[0095]FIG. 12 is another variation on the embodiment of FIGS. 10 and 11.FIG. 12 is a schematic illustration of a tamper indicating RFID loop tag1200, shown in top view, side view and bottom view.

[0096] In FIG. 12, the tamper track 1005 on the underside of thesubstrate 1001 extends beyond the antenna 1003 and forms a “tail” 1201.In the embodiment shown in FIG. 12, the tamper track 1005 is straight.The substrate 1001 may be cut approximately to the shape of theelectronics, so that the loop tag 1200 is broad at the end whichincludes the antenna 1003 and narrow at the tail 1201. Alternatively,the loop tag may be cut into any other shape around the electroniccomponents. Preferably, the tamper track 1005 will extend to the end ofthe tail 1201.

[0097] A bottom layer 1202 may also be applied to a specific portion ofthe underside of the substrate 1001 and tamper track 1005. The tampertrack should extend into the region 1203 of the underside of thesubstrate 1001 which is not covered with the bottom layer 1202. In theregion 1203 where the bottom layer 1202 is not applied, an adhesive,such as a pressure sensitive adhesive 1204 may be applied to theunderside of the substrate 1001 and the tamper track 12100505.

[0098] A top layer 1007 may be applied over the top of the substrate1001, chip 1002 and antenna 1003. The top layer 1007 may provideprotection for these components and may also provide a surface to acceptprinting—for example printing of a number, a barcode, a logo, or otherimage.

[0099] It should be appreciated that in FIG. 12 the top view is a viewlooking through the top layer 1007 to the chip 1002 and antenna 1003,and the bottom view is a view looking through the bottom layer 1202 andadhesive 1204 to the tamper track 1005 and through-connects 1004.

[0100] In operation, the loop tag 1200 may be bent into a loop 1205 andthe region 1203 of pressure sensitive adhesive can be pressed against aregion of the bottom layer 1202, as shown. The pressure sensitiveadhesive 1204 should hold the loop 1205 closed. In another variation, aloop 1206 may be formed by pressing the region 1203 of pressuresensitive adhesive 1204 against a region of the top layer 1007, as alsoshown. (It should be noted that the illustrations of the loops 1205 and1206 do not show the internal components—such as the chip 1002, antenna1003 and tamper track 1005—or the separate layers of the loop tagconstruction.) The two regions of the loop tag which are joined togetherin this way by the pressure sensitive adhesive 1204 preferably bothinclude electronics—for example, the chip 1002, or the antenna 1003, orthe tamper track 1005—in order to ensure the closed loop cannot be cutand the loop opened without the RFID performance of the loop tag 1200being affected. For example, the tamper track tail 1201 may be loopedback and fixed to another portion of the tamper track tail 1201 or maybe looped back and fixed to a region of the underside of the antenna1003 (as illustrated in the loop 1205). The substrate 1001, pressuresensitive adhesive 1204, tamper track 1005, and any adhesion modifyingcoatings which are applied (as described in relation to FIGS. 9 and 10),are preferably designed as described herein such that the tamper track1005 is damaged when the closed loop is pulled apart in the region ofpressure sensitive adhesive 1204, thereby modifying the RFID performanceof the loop tag 1200, as described above in relation to the labelconstructions of FIGS. 9 and 10. A similar modification to theperformance of the loop tag 1200 will occur if the closed loop 1205 or1206 is cut in order to open the loop.

[0101] The loop tag configuration illustrated in FIG. 12 may be used tosecure the tag 1200 around an item such as a handle, or to secure twoitems together. FIG. 13 is a schematic illustration of the use of theloop tag 1200 to detect opening of a container 1300 which includes abody 1301 and lid 1302. The body 1301 and lid 1302 have holes 1303 whichalign when the lid 1302 is placed properly on the body 1301 of thecontainer 1300. FIG. 13 shows a cutaway cross sectional view of aportion of the body 1301 and lid 1302 of the container 1300 in theregion of the holes 1303. In this embodiment the loop tag 1200 isapplied to the container 1300 with the open loop portion 1304 passingthrough the aligned holes 1303. In this implementation the RFID chip1002 in the loop tag 1200 may store information about the contents ofthe container 1300. If the loop tag 1200 is removed from the container1300, either by pulling the loop apart to open the loop or by cuttingthe loop tag, the tamper track 1005 will be interrupted and the RFIDperformance of the loop tag 1200 will be modified in a manner detectableby an RFID reader, as described above in relation to the labelconstruction of FIGS. 9 and 10.

[0102] It should be appreciated that the loop tag 1200 does not need tohave a narrow tail region. The loop tag may instead be rectangular inshape.

[0103] It should be appreciated that variations on the preferredembodiment of FIG. 9 to 12 are possible. For instance, taking the designof FIG. 10 as an example, the chip 1002, antenna 1003 and tamper track1005 may all be on the underside of the substrate 1001. In this case itmay be necessary for the tamper track to cross over the antenna 1003, ona “bridge” layer of electrically insulating material, in order to extendoutside the antenna. The advantage of this embodiment is that thethrough-connects 1004 described in relation to the designs of FIGS. 9and 10 are not required.

[0104] In another embodiment of the invention, a tamper indicating labelis incorporated with an object to which the label is to be applied. Thelabel used may be any of the embodiments described above. FIG. 14illustrates a label 1401 applied to an object 1402. A conductive path1403 should be incorporated into the object. For example, a conductingpath of electrically conducting ink may be formed around the object. Theconducting path 1403 on the object 1402 should have at least two endpoints. The tamper tracks in the label 1401 should have a correspondingnumber of connection points. When the label 1401 is applied to theobject 1402, each end point should be connected to a connection point.The conducting path on the object 1402 and the tamper tracks in thelabel 1401 should together form one or more circuits, each from a tampertrack to an endpoint, through the conducting path on the object, to theother end point and back to a tamper track. If a tamper track isdisrupted through the label 1401 being tampered, or if connectionbetween a tamper track and the conducting path on the object 1402 isbroken, the RFID function of the label 1401 may be modified in a manneras described above to indicate tampering. For example, if the label 1401is applied to a cardboard box and the entire label and that part of thebox the label is adhering to is cut out, tampering is indicated.

[0105] The embodiments illustrated and discussed in this specificationare intended only to teach those skilled in the art the best way knownto the inventors to make and use the invention. Nothing in thisspecification should be considered as limiting the scope of the presentinvention. The above-described embodiments of the invention may bemodified or varied, and elements added or omitted, without departingfrom the invention, as appreciated by those skilled in the art in lightof the above teachings. It is therefore to be understood that, withinthe scope of the claims and their equivalents, the invention may bepracticed otherwise than as specifically described.

I claim:
 1. A tamper indicating label comprising: an RFID layerproviding an RFID function; an adhesive layer supporting the RFID layer;a destructible electrically conducting path sandwiched between the RFIDlayer and the adhesive layer, whereby the destructible conducting pathis disrupted when the label is tampered, thereby modifying the RFIDfunction of the RFID layer.
 2. The tamper indicating label of claim 1wherein the destructible conducting path is an RFID component.
 3. Thetamper indicating label of any of claims 1 or 2 wherein the destructibleconducting path is connected to RFID components in the RFID layer. 4.The tamper indicating label of any of claims 1 or 2 further comprising apattern of an adhesion modifying coating between the RFID layer and theadhesive layer, the adhesion modifying coating modifying adhesioncharacteristics of the destructible conducting path.
 5. The tamperindicating label of claim 4 wherein the pattern of the adhesionmodifying coating includes at least two types of adhesion modifyingcoating.
 6. The tamper indicating label of claim 4 wherein the adhesionmodifying coating is printed on a bottom surface of the RFID layer andthe destructible conducting path is formed on the adhesion modifyingcoating.
 7. The tamper indicating label of claim 4 further comprising avisual tamper indicator arranged under the RFID layer and wherein theRFID layer is substantially transparent whereby the visual tamperindicator is visible.
 8. The tamper indicating label of claim 7 whereinthe visual tamper indicator is a colored layer and an adhesion-modifyingsubstance is arranged between the RFID layer and the adhesive layer, theadhesion-modifying substance causing the colored layer to have differentadhesion strengths with respect to the RFID layer and adhesive layer andthereby create a visual pattern on tampering of the label.
 9. The tamperindicating label of any of claims 1 or 2 wherein the RFID layer includesa memory chip and one of an antenna and an induction loop.
 10. A tamperindicating label comprising: a substrate having RFID components and adestructible conducting path; and an adhesive layer supporting thesubstrate, at least a part of the destructible conducting path being incontact with the adhesive layer, whereby the destructible conductingpath is modified if the label is at least partially removed from asurface to which it has been applied, thereby modifying RFIDcharacteristics of the RFID components.
 11. The tamper indicating labelof claim 10 further comprising: a second conducting path formed on a topsurface of the substrate and wherein the RFID components include anintegrated circuit chip on the top surface of the substrate, theintegrated circuit chip being connected to the second conducting path;and through-connects linking the second conducting path with thedestructible conducting path, which is formed on a bottom surface of thesubstrate.
 12. The tamper indicating label of claim 11 wherein thesecond conducting path and the destructible conducting path togetherform one of an antenna and an induction loop.
 13. The tamper indicatinglabel of any of claims 10 to 12 or 57 further comprising a top coatingformed over the top surface of the substrate.
 14. The tamper indicatinglabel of any of claims 10 to 12 or 57 further comprising anadhesion-modifying coating between the substrate and the adhesive layer,the adhesion-modifying coating causing the adhesion strengths of thedestructible conducting path to vary.
 15. A security label forattachment to an object, comprising: RFID components providing an RFIDfunction; means for attaching the RFID components to the object; aconducting path connected to the RFID components and contacting themeans for attaching, the conducting path being interrupted orsubstantially disrupted when the label is tampered, thereby modifyingthe RFID characteristics of the RFID components.
 16. The security labelof claim 15 further comprising a substrate supporting the RFIDcomponents and wherein the RFID components comprise a computer chip on abottom surface of the substrate and the conducting path forms one of anantenna and an induction loop on the bottom surface of the substrate.17. The security label of claim 15 further comprising: a substrate, theRFID components being formed on a top surface of the substrate; andconnection points extending from the RFID components to a bottom surfaceof the substrate, wherein the conducting path is formed on a bottomsurface of the substrate and connects the connection points.
 18. Thesecurity label of claim 16 or 17 wherein the conducting path must beintact for the RFID components to operate.
 19. The security label ofclaim 17 wherein the conducting path is a circuit functionally separatefrom the RFID components.
 20. The security label of any of claims 17 or19 wherein the conducting path is a track of conducting material formedin a pattern that extends around substantially the entire circumferenceof the bottom surface of the substrate.
 21. The security label of claim17 wherein the RFID components include an induction loop or antenna andthe conducting path is formed in series with the induction loop orantenna.
 22. The security label of claim 17, wherein the conducting pathforms an induction loop or antenna.
 23. The security label of claim 15further comprising: a substrate, the RFID components formed on a topsurface of the substrate; and connection points extending from the RFIDcomponents to a bottom surface of the substrate, wherein a portion ofthe conducting path extends from each connection point to form aninduction loop or antenna.
 24. The security label of claim 23 whereinthe conducting path must be intact for the RFID components to operate.25. A tamper indicating RF identification system, comprising: asubstrate having a top and a bottom surface; RFID components applied tothe bottom surface of the substrate; a conductive layer applied in apattern to the bottom surface of the substrate; an adhesive layersupporting the substrate such that the RFID electronic components andthe conductive layer are sandwiched between the substrate and theadhesive layer, and wherein the adhesive layer, the substrate, andconductive layer have relative adhesion strengths such that when thesystem is partially removed from a surface to which it has been applied,at least one of the RFID components and the conductive layer is alteredto modify the RFID characteristics of the system.
 26. A securityapparatus for indicating tampering, comprising: an object having aconducting path with at least two end points; a security label arrangedon the object, the label comprising RFID components and a destructibleconducting path between the RFID components and individual end points.27. The apparatus of claim 26 wherein a disruption to the destructibleconducting path or the conducting path causes a detectable modificationto the RFID function of said RFID components.
 28. The apparatus of claim26 or 27 wherein RFID components respond in a pre-determined manner whena connection between the RFID components and end points is interruptedor substantially disrupted, or when the electrical pathway through theconducting path and the destructible conducting path is interrupted orsubstantially modified.
 29. The combination of a security label and anobject, wherein: the security label comprises: RFID components; meansfor attaching the RFID components to the object; and destructibleelectronics connected to the RFID components, the destructibleelectronics being broken or substantially disrupted when the label is atleast partially removed from the object; and the object comprises: asurface for receiving the security label; a conducting path having twoends, the ends of the conducting path being coupled to the destructibleelectronics thereby forming a circuit through the RFID components, thedestructible electronics and the conducting path, whereby RFIDcharacteristics of the RFID components are modified if the connectionbetween the end points and the RFID components, via the destructibleelectronics, or through the conducting path, is interrupted orsubstantially disrupted.
 30. A tamper indicating label, comprising: RFIDcomponents; means for attaching the RFID components to an object; and atamper track connected to the RFID components, the tamper track beingone or more electrically conducting pathways adapted to be damaged whenthe label is tampered and the RFID components being adapted to detect aninterruption in, or substantial disruption to, the tamper track whilemaintaining their RFID capability.
 31. The label of claim 30 wherein thetamper track is interrupted or substantially disrupted when the meansfor attaching is interfered with.
 32. The label of any of claims 30 or31 wherein the RFID components are active components.
 33. The label ofclaim 32 wherein the RFID components test the tamper track and recorddata if the tamper track is interrupted.
 34. The label of any of claims30 and 31 wherein the RFID components are passive.
 35. The label of anyof claims 30 and 31 wherein the RFID components include only a memorychip.
 36. The label of any of claims 30 to 31 wherein the memory chip ispermanently altered when the interruption in the tamper track isdetected.
 37. A tamper indicating label, comprising: a substrate; anadhesive layer; a tamper track arranged between a first side of thesubstrate and the adhesive layer, portions of the tamper track havingdifferent adhering strengths to the substrate and the adhesive layerwhereby the tamper track is disrupted when the label is tampered with;an RFID chip arranged on a second side of the substrate and electricallyconnected to the tamper track via through connects in the substrate, theRFID chip being connected to other RFID components to provide an RFIDfunction and detecting any disruption in the tamper track whilemaintaining the RFID function.
 38. The label of claim 37, wherein theRFID chip is electrically connected to the tamper track via contactpads.
 39. The label of claim 38, comprising two contact pads connectedto the tamper track.
 40. The label of any of claims 37 to 39, whereinthe RFID chip is permanently altered when the tamper track is disrupted.41. The label of any of claims 37 to 39, further comprising one of anantenna and an induction loop formed on the second side of the substrateand connected to the RFID chip.
 42. The label of claim 41, wherein oneof antenna and the induction loop are connected to the RFID chip via twocontact pads.
 43. The label of any of claims 37 to 39 wherein when thetamper track is interrupted, or substantially disrupted, the functionsor characteristics of the RFID chip are altered in a manner detectableby an RFID reading device so as to indicate the tamper track has beeninterrupted or substantially disrupted.
 44. A tamper indicating labelcomprising: a substrate having first and second portions, the secondportion being adapted to be looped back and connected to the firstportion; an RFID transponder arranged on the substrate; a tamper trackcoupled to the RFID transponder and extending at least partially intothe second portion of the substrate; an adhesive layer arranged on atleast a part of the substrate in the second portion that contains thetamper track, the tamper track in that part of the substrate beingadapted to be modified due to the relative adhesion strength of thetamper track when the label is tampered.
 45. The label of claim 44wherein the second portion is connected to the first portion by theadhesive layer in an area where either the RFID transponder or thetamper track is arranged.
 46. The label of any of claims 44 and 45wherein the adhesive layer is also arranged on the first portion of thesubstrate in an area where the second portion is connected.
 47. Thelabel of any of claims 44 to 45 further comprising a top or bottom layerformed on regions of the substrate where the adhesive layer is notpresent.
 48. An RFID read/write apparatus, comprising: means for readinginformation from an RFID label; means for interpreting the informationto determine if the label is tampered; and means for writing data to thelabel indicating the label is tampered if the information indicates thelabel is tampered.
 49. The apparatus of claim 48 wherein the data iswritten permanently to a chip in the label.
 50. A tamper indicatingapparatus, comprising: RFID components providing an RFID function; adestructible conducting path associated with the RFID components; anadhesive layer for attaching the RFID components and the destructibleconducting path to an object, wherein the RFID components comprise meansfor detecting and indicating a disruption in the destructible conductingpath.
 51. The apparatus of claim 50, wherein the RFID components furthercomprise an electronic memory chip, the electronic chip memory contentsbeing modified when a disruption in the destructible conducting path isdetected.
 52. The apparatus of claim 51, wherein the RFID componentsfurther comprise a clock, the electronic memory chip recording the dateand time when the disruption is detected.
 53. The apparatus of any ofclaims 50 to 52, wherein the memory of the electronic memory chip ispermanently modified.
 54. The apparatus of any of claims 50 to 52,wherein the RFID components are active RFID components.
 55. Theapparatus of any of claims 50 to 52, wherein the RFID components furthercomprise an induction loop or antenna.
 56. The tamper indicating labelof claim 4 wherein the adhesion modifying layer is between the adhesivelayer and the destructible conducting path.
 57. The tamper indicatinglabel of claim 11 wherein the second conducting path forms one of anantenna and an induction loop, and the destructible conducting pathforms a functionally separate electrical circuit.
 58. The security labelof claim 17 wherein the RFID components include an induction loop orantenna and the conducting path is formed in parallel with saidinduction loop or antenna.
 59. The system of claim 25 further comprisingan adhesion modifying layer to adjust the relative adhesions strengths.60. The label of claim 31 wherein the means for attaching is a layer ofpressure sensitive adhesive.
 61. The label of claim 42, wherein thecontact pads described in claim 42 are different contact pads from thosedescribed in claim
 38. 62. The label of any of the preceding claims,wherein the destructible conducting path or tamper track is formed usingan electrically conducting ink.